Thermco has characterised all critical atmospheric and CVD processes for technologies down to 0.35 micron, these processes can also be used for non critical (bulk processing) applications at advanced technology nodes. Standard processes include:


  • Wet oxidation
  • Dry oxidation
  • Inert gas anneal ( N2, Ar, etc.)
  • Forming gas and H2 anneals
  • N type doping
  • P type doping
  • Low temp cure
  • High temp drive in


  • Nitride
  • TEOS
  • HTO
  • Flat temp Polysilicon
  • Ramped temp Polysilicon
  • Doped Polysilicon (P and N type)
  • LTO
  • BPSG