Porous Silicon Formation

Porous silicon is manufactured on silicon wafers by utilizing a process of anodising which creates thin films with pores where you can accurately control the size from angstroms down to tens of microns in thickness. Porous silicon formation is popularly used for applications such as semiconductors, MEM’s, medical and photovoltaic cells (solar cells). Although it is relatively easy to produce very small amounts of porous silicon within the confines of a lab, when it comes to scaling up the process to the size required to build products you need very specialised equipment due to the use of HF acid & alcohol in combination with a considerable amount of electric current. Specialised porous silicon formation manufacturing equipment is needed, such as a pilot tool or HVM system.





 

Porous silicon process tools for the following applications:

  • Semiconductor
  • MEM’s
  • Nano
  • PV
  • Industrial
  • Medical
  • Nano pores
  • Meso pores
  • Macro pore formation
  • Electro polish capability
  • Pilot Tool: Semi Automated Single cell processing
  • Mini-HVM Tool: Fully or Semi-automated  system with up to 6 cells
  • HVM Tool: Fully Automated Multi cell processing
  • Multiple wafer sizes & shapes
  • 100% porous silicon coverage

 

Pore Size Control By Application

  • Nano pores
  • Meso pores
  • Macro pore formation
  • Electro polish capability

 

Types Of Systems Available

  • Pilot Tool: Semi Automated Single cell processing
  • Mini-HVM Tool: Fully or Semi-automated  system with up to 6 cells
  • HVM Tool: Fully Automated Multi cell processing
  • Multiple wafer sizes & shapes
  • 100% porous silicon coverage

 

Throughput:

Pilot tool:  5-10 WPH

Mini HVM tool: 100 -180 WPH

HVM Tool: >500 WPH

 

Other Applications and Experience:

  • Bragg reflectors
  • Through Silicon Via (TSV) etching
  • Medical capilliary structures
  • Large surface areas for drug delivery
  • Catalyst carrier
  • Fuel cell technology
  • Structural etching for MEM’s
  • Vacuum pressure sensor formation

 

Features:

  • Round or square substrates
  • CFD designed. Chambers modelled for fluid flow and current density
  • Full area coverage
  • Thin wafer handling
  • Chemical management
  • Acid or alcohol third compound compatibility
  • Programmable power supply including pulse reverse feature.
  • Full safety and CE compliance
  • Advanced contact. (release end of 2014)

 

Benefits

Although choosing Thermoco T-Clean for your manufacturing  equipment will be a major benefit in itself, here are a some more of the benefits you get with using one of our specialised porous silicon formation machines:

  • A flexible programmable recipe
  • Ability to save recipes for easy future access
  • A fully configurable process using multiple customisable steps
  • A choice of semi-automated or fully automated
  • The porous silicon formation systems removes any need for human contact with the dangerous water or electrolyte by completing those steps in a closed environment automatically
  • The flexible recipe system allows for automatic adjustment of the etching current