Critical to most MEMS applications is quality of film, and this poses specific issues as the required films are typically much thicker than equivalent semiconductor applications. Thermco has characterised the following standard processes and works closely with customers on specific applications:

  • Low stress Nitride
  • Oxy-Nitride / SIPOS
  • Polysilicon- doped and undoped
  • TEOS with highly uniform step coverage
  • Thick uniform oxide
  • Low temperature anneal