LED process applications using III/V materials on Silicon and Sapphire substrates often have a critical thermal budget, and many processes are performed at relatively low temperatures. Thermco’s advanced equipment designs include special low temperature heating chambers and controlled environment wafer loading systems. Typical processes for LED devices include:

  • Low temperature anneal with controlled ambient loading
  • Resist cure
  • Standard anneal / alloy process
  • Zinc and N2 doping